Spring clamp assembly for improving thermal contact between stacked electronic components
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United States of America Patent
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Jun 23, 1998
Grant Date -
N/A
app pub date -
Sep 3, 1996
filing date -
Sep 3, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A spring clamp device providing a compressive stress to a stack of components includes a spring member and a bracket having attachment structure for engaging mating structure near the bottom of the stack. The bracket is first engaged with the mating structure such that it straddles the stack. The spring member is then latched to the bracket under tension in an assembled configuration, thereby applying an upward reaction on the mating structure with the attachment structure of the bracket and applying a downward reaction force to the top of the stack with the spring member. The oppositely directed forces apply a compressive stress to the stack, which improves thermal contact between the components.
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