Passivation of organic devices
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United States of America Patent
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Jun 30, 1998
Grant Date -
N/A
app pub date -
May 2, 1995
filing date -
May 2, 1995
priority date (Note) -
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Abstract
A method of passivating organic devices positioned on a supporting substrate including the steps of overcoating the organic device with a low temperature deposited film of dielectric material, and sealingly engaging an inorganic layer over the dielectric material so as to substantially hermetically seal the organic device. In a typical embodiment, the dielectric layer is SiO.sub.2 and the inorganic layer is a metal can.
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