Printhead for liquid metals and method of use
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United States of America Patent
Stats
-
Jun 30, 1998
Grant Date -
N/A
app pub date -
Dec 29, 1995
filing date -
Dec 29, 1995
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A compact printhead assembly is designed for employment in a soldering operation without the need for fluxes and without conducting the operation in a confined chamber. A self-contained printhead assembly has an internal reservoir and internal heating elements for raising the temperature above the melting temperature of solder or other liquid to be dispensed in microdroplets from a working surface at one end of the printhead housing. A jetting device containing an electro-mechanical transducer is pulsed to produced droplets at an exit orifice located at the working surface. Inert gas is preheated by the housing and delivered to the working surface to establish an oxygen-free atmosphere around the exit orifice and between the working surface and a substrate located a working distance away, whereby microdrops can be formed and deposited without harmful oxidation.
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