Polishing agent and polishing method
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United States of America Patent
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Jun 30, 1998
Grant Date -
N/A
app pub date -
Sep 21, 1995
filing date -
Sep 30, 1994
priority date (Note) -
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Abstract
An organic insulating film is polished utilizing a polishing agent containing cerium oxide particles (a ceria slurry). The ceria slurry is composed of cerium oxide powder containing a total concentration of Na, Ca, Fe, and Cr of less than 10 ppm. Fragile inorganic and organic insulating films formed at relatively low temperatures can be polished without degrading characteristics of a semiconductor element having such films thereon, due to, e.g., Na diffusion.
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