US Patent No: 5,772,780

Number of patents in Portfolio can not be more than 2000

Polishing agent and polishing method

Stats

ATTORNEY / AGENT: (SPONSORED)
 

Importance

Loading Importance Indicators... loading....

Abstract

An organic insulating film is polished utilizing a polishing agent containing cerium oxide particles (a ceria slurry). The ceria slurry is composed of cerium oxide powder containing a total concentration of Na, Ca, Fe, and Cr of less than 10 ppm. Fragile inorganic and organic insulating films formed at relatively low temperatures can be polished without degrading characteristics of a semiconductor element having such films thereon, due to, e.g., Na diffusion.

Loading the Abstract Image... loading....

First Claim

Related Publications

Loading Related Publications... loading....

Patent Owner(s)

Patent OwnerAddressTotal Patents
RENESAS ELECTRONICS CORPORATIONTOKYO13400

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Homma, Yoshio Hinode, JP 56 1059
Kusukawa, Kikuo Saitama, JP 29 367
Moriyama, Shigeo Tama, JP 48 1099
Nagasawa, Masayuki Tokyo, JP 14 66

Cited Art

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (4)
4,671,851 Method for removing protuberances at the surface of a semiconductor wafer using a chem-mech polishing technique 155 1985
4,944,836 Chem-mech polishing method for producing coplanar metal/insulator films on a substrate 329 1985
4,910,155 Wafer flood polishing 168 1988
5,084,071 Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor 157 1990
 
LSI LOGIC CORPORATION (3)
5,245,790 Ultrasonic energy enhanced chemi-mechanical polishing of silicon wafers 160 1992
5,265,378 Detecting the endpoint of chem-mech polishing and resulting semiconductor device 91 1992
5,403,228 Techniques for assembling polishing pads for silicon wafer polishing 68 1993
 
ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. (2)
5,264,010 Compositions and methods for polishing and planarizing surfaces 111 1992
5,382,272 Activated polishing compositions 26 1993
 
CABOT MICROELECTRONICS CORPORATION (1)
4,954,142 Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor 202 1989
 
CFM TECHNOLOGIES RESEARCH ASSOCIATES (1)
4,795,497 Method and system for fluid treatment of semiconductor wafers 60 1985
 
FREESCALE SEMICONDUCTOR, INC. (1)
5,139,571 Non-contaminating wafer polishing slurry 30 1991
 
KABUSHIKI KAISHA TOSHIBA (1)
5,445,996 Method for planarizing a semiconductor device having a amorphous layer 47 1993
 
KONICA CORPORATION (1)
4,483,107 Polishing method for electrophotographic photoconductive member 15 1982
 
ROUND ROCK RESEARCH, LLC (1)
5,036,015 Method of endpoint detection during chemical/mechanical planarization of semiconductor wafers 279 1990
 
SEMATECH, INC. (1)
5,439,569 Concentration measurement and control of hydrogen peroxide and acid/base component in a semiconductor bath 39 1994

Patent Citation Ranking

Forward Cites

Patent Info (Count) # Cites Year
 
HITACHI CHEMICAL COMPANY, LTD. (7)
6,343,976 Abrasive, method of polishing wafer, and method of producing semiconductor device 19 2000
7,115,021 Abrasive, method of polishing target member and process for producing semiconductor device 2 2002
7,871,308 Abrasive, method of polishing target member and process for producing semiconductor device 0 2006
8,162,725 Abrasive, method of polishing target member and process for producing semiconductor device 0 2007
7,963,825 Abrasive, method of polishing target member and process for producing semiconductor device 0 2008
8,323,604 Cerium salt, producing method thereof, cerium oxide and cerium based polishing slurry 0 2010
8,137,159 Abrasive, method of polishing target member and process for producing semiconductor device 0 2011
 
K.C. TECH CO., LTD. (4)
7,470,295 Polishing slurry, method of producing same, and method of polishing substrate 1 2005
7,364,600 Slurry for CMP and method of polishing substrate using same 1 2005
8,062,547 CMP slurry, preparation method thereof and method of polishing substrate using the same 0 2006
8,361,177 Polishing slurry, method of producing same, and method of polishing substrate 0 2008
 
HONEYWELL INTERNATIONAL INC. (3)
6,416,685 Chemical mechanical planarization of low dielectric constant materials 35 2000
6,610,114 Oxidizing polishing slurries for low dielectric constant materials 5 2001
6,736,992 Chemical mechanical planarization of low dielectric constant materials 6 2002
 
NXP B.V. (3)
6,638,145 Constant pH polish and scrub 4 2001
6,585,567 Short CMP polish method 0 2001
6,875,089 Constant pH polish and scrub 1 2003
 
ADVANCED MICRO DEVICES, INC. (1)
6,326,305 Ceria removal in chemical-mechanical polishing of integrated circuits 11 2000
 
ALLIEDSIGNAL INC. (1)
6,270,395 Oxidizing polishing slurries for low dielectric constant materials 29 1998
 
APPLIED MATERIALS, INC. (1)
6,653,242 Solution to metal re-deposition during substrate planarization 18 2000
 
GLOBALFOUNDRIES INC. (1)
6,169,034 Chemically removable Cu CMP slurry abrasive 11 1998
 
HGST NETHERLANDS B.V. (1)
6,402,851 Lanthanide oxide dissolution from glass surface 5 2000
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (1)
6,580,586 Magnetic transducer with recessed magnetic elements 7 2001
 
MITSUI MINING & SMELTING CO., LTD. (1)
6,689,178 Cerium based abrasive material and method for producing cerium based abrasive material 5 2002
 
NISSAN CHEMICAL INDUSTRIES, LTD. (1)
7,578,862 Abrasive compound for glass hard disk platter 0 2003
 
RENESAS ELECTRONICS CORPORATION (1)
6,147,001 Method of manufacturing semiconductor integrated circuit device 2 1997
 
RHODIA OPERATIONS (1)
8,366,959 Abrasive compositions for chemical mechanical polishing and methods for using same 0 2009
 
SHOWA DENKO K.K. (1)
6,733,553 Abrasive composition for polishing semiconductor device and method for producing semiconductor device using the same 5 2001