Moldings of polyurethane hotmelt adhesives
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United States of America Patent
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-
Jul 7, 1998
Grant Date -
N/A
app pub date -
Jun 23, 1997
filing date -
Dec 23, 1994
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The invention relates to the use of moisture-curing PU hotmelt adhesives as molding compounds for the production of moldings, the PU hotmelt adhesives having a melt viscosity of less than 100 Pa.multidot.s at the processing temperature of 70.degree. to 190.degree. C. To produce the moldings, the molding compound is melted at temperatures of 70.degree. to 200.degree. C., the melt is injected into closed molds under an excess pressure of 1 to 50 bar, the cooled moldings are removed from the mold after a short time and are then cured with atmospheric moisture. Economic and technical advantages include distinctly lower processing pressures, expense on machinery and tooling and firm adhesion to various substrates. The moldings are heat-resistant and adhere to various substrates. They are particularly suitable for the production of electrical components.
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