Exposure mask, method of producing the same, exposure mask producing apparatus, and method of forming surface profile on material using exposure mask

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United States of America Patent

PATENT NO 5776639
SERIAL NO

08629224

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Abstract

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A two-dimensional shape of a dotted pattern and optical densities of dots or sizes of dots having the same optical density are calculated as write data on the basis of a target distribution of transmittance. The dotted pattern is optically written on a photosensitive medium in accordance with the calculated write data, using a beam from a light source whose output is stepwise or sequentially variable. A latent dotted pattern on the photosensitive medium is developed, thereby obtaining an exposure mask having a desired two-dimensional distribution of transmittance expressed by the dotted pattern and the optical densities of dots or the sizes of dots having the same optical density.

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Patent Owner(s)

Patent OwnerAddress
RICOH OPTICAL INDUSTRIES CO LTDKANAGAWA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Sato, Shosen Hanamaki, JP 2 25
Umeki, Kazuhiro Hanamaki, JP 13 167

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