Resin sealing type semiconductor device having thin portions formed on the leads
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United States of America Patent
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Jul 7, 1998
Grant Date -
N/A
app pub date -
Mar 14, 1996
filing date -
Mar 17, 1995
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A resin sealing type semiconductor device includes a radiator, a semiconductor element, a frame lead arranged at a distance around this semiconductor element and displaced from the radiator, and a plurality of leads extending from this frame lead and attached to a mounting surface with a insulating lead support therebetween. The leads are pressed downward by an upper mold so that the radiator is pressed against a lower mold in such a manner that resin cannot seep therebetween. Thin portions are formed in the leads to ensure that the leads do not peel away from the insulating lead support.
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Cited Art Landscape
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