Electrostatic chuck and method of attracting wafer
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United States of America Patent
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Jul 7, 1998
Grant Date -
N/A
app pub date -
Nov 20, 1996
filing date -
Dec 19, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An electrostatic chuck including an electrode having first and second surfaces, a dielectric member having a first layer for covering at least the first surface of the electrode, a power supply for conducting electric power to the electrode, and a cooling gas-feeding means for feeding a cooling gas onto the surface of the first layer of the dielectric member. A plurality of fine projections 28 are formed on the surface of the first layer of the dielectric member. Each of the fine projections 28 has a tip smaller than a root thereof so as to hold a wafer W in substantially a point-contact manner. The wafer can be held on the surface of the first layer of the dielectric member and cooled by the cooling gas fed from the cooling gas-feeding means.
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