Multichip module having a cover wtih support pillar
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United States of America Patent
Stats
-
Jul 7, 1998
Issued Date -
N/A
app pub date -
Mar 6, 1997
filing date -
Sep 27, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A multichip module comprises a substrate mounting a plurality of circuit chips, a cover plate positioned over the circuit chips, and at least one pillar member for fixing the cover plate to the substrate to support it. The substrate has a plurality of circuit chips fixed in a predetermined pattern of locations on a side thereof. At least one pillar member fixes the cover plate to the substrate such that the cover plate is positioned over the circuit chips. Since the pillar member is fixed to the substrate at a small area to support the cover plate, the substrate can be prevented from deforming due to a temperature change. In order to secure the covering member, the pillar member is preferably fixed by means of an adhesive, a fit, or screwing.
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