LED display packaging with substrate removal and method of fabrication
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United States of America Patent
Stats
-
Jul 14, 1998
Issued Date -
N/A
app pub date -
Aug 19, 1996
filing date -
Jan 18, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A light emitting diode display package and method of fabricating a light emitting diode (LED) display package including a light emitting diode array on a substrate, having row and column connection pads routed to display connection pads positioned on an uppermost surface of the LED array device, a separate silicon driver device having connection pads routed to an uppermost surface, positioned to cooperatively meet those of the LED device when properly registered, the LED device flip chip bump bonded to the driver device using standard C5 DCA, an underfill layer positioned between the space defined by the LED device and the driver device. The LED display and driver device package subsequently having selectively removed the substrate onto which the LED array was initially formed. The light emitted from the LED display device, being emitted through the remaining indium-gallium-aluminum-phosphide (InGaAlP) epilayer of the LED device.
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