Etching composition and use thereof
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United States of America Patent
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Jul 14, 1998
Grant Date -
N/A
app pub date -
Apr 4, 1997
filing date -
Apr 4, 1997
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An aqueous etchant composition containing about 0.01 to about 15 percent by weight of sulfuric acid and about 0.01 to about 20 percent by weight of hydrogen peroxide or about 1 to 30 ppm of ozone is effective in removing polymer residue from a substrate, and especially from an integrated circuit chip having aluminum lines thereon.
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