Conductive cooling of a heat-generating electronic component using a cured-in-place, thermally-conductive interlayer having a filler of controlled particle size
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United States of America Patent
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Jul 14, 1998
Grant Date -
N/A
app pub date -
Nov 22, 1996
filing date -
Nov 22, 1996
priority date (Note) -
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Abstract
Conductive cooling of a heat-generating electronic component disposable in spaced-apart adjacency with a surface of a thermal dissipation member to define a gap of predetermined width therebetween. A curable composition is provided as formed of an electrically-insulating polymeric binder having thermally-conductive, electrically-insulating filler particles dispersed therein. At least a portion of the filler particles is of a maximum average diameter about equal to the predetermined width of the gap. A layer of the composition is disposable in conductive heat transfer contact with the electronic component and the surface of the thermal dissipation member, and is cured to form an interlayer within the gap. At least a portion of the filler particles of the specified maximum average diameter each substantially directly contact the electronic component and the surface of the thermal dissipation member to establish thermally-conductive pathways effective to transfer heat from the electronic component to the heat dissipation member.
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