Digital microelectronic circuit package using buffer dies and programmable device or memory dies
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United States of America Patent
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Jul 14, 1998
Grant Date -
N/A
app pub date -
Apr 16, 1996
filing date -
Apr 16, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A digital microelectronic replacement package includes at least one buffer die in combination with a programmable device or memory. The buffer die performs the functions of impedance-matching, delay-matching, and voltage-matching, while the programmable device or memory can be used to emulate the logic and/or storage functions of the original digital microelectronic circuit; the package of the invention can be used as a direct replacement for a digital microelectronic circuit without the requirement that the original circuit board be redesigned to accommodate modern voltage, impedance, and delay specifications associated with the programmable device or memory.
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