Composite material having high thermal conductivity and process for fabricating same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5783316
SERIAL NO

08703914

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A process for fabricating a composite material such as that having high thermal conductivity and having specific application as a heat sink or heat spreader for high density integrated circuits. The composite material produced by this process has a thermal conductivity between that of diamond and copper, and basically consists of coated diamond particles dispersed in a high conductivity metal, such as copper. The composite material can be fabricated in small or relatively large sizes using inexpensive materials. The process basically consists, for example, of sputter coating diamond powder with several elements, including a carbide forming element and a brazeable material, compacting them into a porous body, and infiltrating the porous body with a suitable braze material, such as copper-silver alloy, thereby producing a dense diamond-copper composite material with a thermal conductivity comparable to synthetic diamond films at a fraction of the cost.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
LAWRENCE LIVERMORE NATIONAL SECURITY, LLCLIVERMORE, CA1110

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Colella, Nicholas J Livermore, CA 12 240
Davidson, Howard L San Carlos, CA 53 1177
Kerns, John A Livermore, CA 6 67
Makowiecki, Daniel M Livermore, CA 25 536

Cited Art Landscape

Patent Info (Count) # Cites Year
 
Other [Check patent profile for assignment information] (1)
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GENERAL ELECTRIC COMPANY (1)
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NORTON COMPANY (2)
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* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
Other [Check patent profile for assignment information] (8)
* 2003/0156,400 Method and apparatus for providing power to a microprocessor with intergrated thermal and EMI management 64 2003
6915796 Superabrasive wire saw and associated methods of manufacture 53 2003
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6984888 Carbonaceous composite heat spreader and associated methods 16 2003
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MOLEX, LLC (8)
6847529 Ultra-low impedance power interconnection system for electronic packages 13 2001
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6623279 Separable power delivery connector 13 2002
6947293 Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management 8 2002
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MOLEX INCORPORATED (5)
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* 2006/0219,329 Repair nickel-based superalloy and methods for refurbishment of gas turbine components 4 2005
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SUMITOMO ELECTRIC INDUSTRIES, LTD. (3)
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6270848 Heat sink material for use with semiconductor component and method for fabricating the same, and semiconductor package using the same 19 2000
 
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* 2003/0232,463 Carbon foam heat exchanger for intedgrated circuit 3 2003
 
M/A-COM TECHNOLOGY SOLUTIONS HOLDINGS, INC. (1)
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Lasertel, Inc. (3)
7660335 Liquid cooled laser bar arrays incorporating diamond/copper expansion matched materials 3 2008
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HITACHI POWDERED METALS CO., LTD. (1)
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ALFA LAVAL CORPORATE AB (1)
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US SYNTHETIC CORPORATION (1)
6338754 Synthetic gasket material 49 2000
 
UNITED TECHNOLOGIES CORPORATION (1)
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* Cited By Examiner