Method of forming a hermetically sealed circuit lead-on package
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United States of America Patent
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Jul 21, 1998
Issued Date -
N/A
app pub date -
Feb 11, 1997
filing date -
Jun 26, 1992
priority date (Note) -
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Abstract
A hermetically sealed ceramic integrated circuit package and method for achieving same, the package including an internal lead frame attached to an integrated circuit die in a lead-on-chip configuration, an external lead frame attached to the package exterior in a lead-on-package configuration and a high temperature adhesive layer which attaches the internal lead frame to the integrated circuit die.
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