Wiring board for supporting an array of imaging chips
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United States of America Patent
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-
Jul 21, 1998
Grant Date -
N/A
app pub date -
Apr 11, 1997
filing date -
Apr 11, 1997
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A printed wiring board includes features which allow the board to be held firmly in place by a vacuum mounting device so that semiconductor chips can be placed thereon, and wire bonds established between the semiconductor chips and the circuitry on the board. The side of the board opposite the side having the semiconductor chips defines a ridge which encloses a portion of the surface area thereof. The ridge forms a gasket around a vacuum slot on the vacuum mounting device. The ridge also provides a firm surface for wirebonds to be ultrasonically welded to landings on the board.
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