Gas-damped micromechanical structure
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United States of America Patent
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Jul 28, 1998
Grant Date -
N/A
app pub date -
Mar 12, 1997
filing date -
Mar 12, 1997
priority date (Note) -
In Force
status (Latency Note)
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Abstract
An improved squeeze-type micromechanical structure for high speed operation, i.e., greater than 1 MHz, is disclosed. The structure has a movable member possessing damping holes. The porosity, 1/(.omega..sub.o .tau.), of the movable member is at least about 1.4. The structure is hermetically sealed and is maintained above atmospheric pressure and at a minimum reduced pressure or gas frequency, .omega..sub.g /.omega..sub.o, of about 1.3. To operate with less than 10 percent 'ringing,' .omega..sub.g /.omega..sub.o >1.3 and 0.25+0.7(.omega..sub.g /.omega..sub.o).sup.2 -0.8(.omega..sub.g /.omega..sub.o -1.25).ltoreq.1/(.omega..sub.o .tau.).ltoreq.0.25+0.7(.omega..sub.g /.omega..sub.o).sup.2 +(.omega..sub.g /.omega..sub.o -1.25).
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