Method and apparatus for vertical transfer of a semiconductor wafer cassette
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United States of America Patent
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Aug 4, 1998
Grant Date -
N/A
app pub date -
Jul 10, 1995
filing date -
Jul 10, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method and apparatus for removing a semiconductor wafer cassette from a SMIF pod and for transferring the cassette along a vertical axis to a platform of a wafer processing station. The apparatus is comprised of a transfer device that includes a pair of gripping arms for gripping the wafer cassette from the sides of the cassette. Once gripped, the cassette moves with the transfer device upward along a vertical axis to make room for the platform to be extended from within the processing station to a position under the cassette. Thereafter, the direction of motion of the transfer device is reversed and the cassette is lowered onto the platform. Once seated on the platform, the gripping arms retract from the cassette, and the cassette is carried on the platform into the processing station.
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