Substrate spin treating method and apparatus
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United States of America Patent
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Aug 4, 1998
Grant Date -
N/A
app pub date -
Oct 11, 1996
filing date -
Oct 25, 1995
priority date (Note) -
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Abstract
A baffle is placed in a position opposed to discharge openings of a treating solution supply nozzle and between the discharge openings and the surface of a substrate. The baffle intercepts a treating solution discharged from the discharge openings, whereby the treating solution is supplied evenly to the surface of the substrate by flowing over a surface of the baffle and falling from an edge of the baffle to the substrate, instead of falling from the discharge openings directly to the substrate. No microbubbles are formed in the treating solution on the substrate, which would cause an unevenness of treatment. The discharge openings may be defined by a plurality of circular bores formed in the supply nozzle. Each circular bore may have a diameter at least equal to a spacing between an adjacent pair of circular bores.
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