Method and apparatus for controlling plating thickness of a workpiece
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United States of America Patent
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Aug 4, 1998
Grant Date -
N/A
app pub date -
Oct 16, 1996
filing date -
Oct 16, 1996
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method and apparatus for electroplating a workpiece to achieve a uniform plating thickness includes a cathode rack having a hook from which the workpiece is suspended and spaced apart from a consumable anode. The rack includes a plurality of plates made of the same material as the anode disposed on opposite sides of the rack. The plates direct a portion of the current emanating from the anode away from the workpiece to produce more uniform plating.
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