Method of chemically depositing material onto a substrate
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United States of America Patent
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Aug 4, 1998
Grant Date -
N/A
app pub date -
Nov 12, 1996
filing date -
Nov 12, 1996
priority date (Note) -
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Abstract
Methods are described for depositing a film of material on the surface of a substrate by i) dissolving a precursor of the material into a supercritical or near-supercritical solvent to form a supercritical or near-supercritical solution; ii) exposing the substrate to the solution, under conditions at which the precursor is stable in the solution; and iii) mixing a reaction reagent into the solution under conditions that initiate a chemical reaction involving the precursor, thereby depositing the material onto the solid substrate, while maintaining supercritical or near-supercritical conditions. The invention also includes similar methods for depositing material particles into porous solids, and films of materials on substrates or porous solids having material particles deposited in them.
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