Method for fabricating a multiple chip module using orthogonal reorientation of connection planes
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United States of America Patent
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Aug 4, 1998
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N/A
app pub date -
Dec 15, 1995
filing date -
Dec 15, 1995
priority date (Note) -
Expired
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Abstract
A multiple chip module architecture capable of forming structures having selectable aspect ratios which themselves form the basis for higher levels of integration in analogous manner. The modular architecture uses a flexible interconnect of patterned copper on polymer to successively reorient the connection plane between successive levels, permitting the selective stacking of module levels to create the desired aspect ratio of the multiple chip module. Interconnection between levels may be accomplished by solder reflow, direct dendritic bonding, or connection through a dendritic interposer.
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