Inverted chip bonded with high packaging efficiency
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United States of America Patent
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Aug 11, 1998
Issued Date -
N/A
app pub date -
Mar 3, 1997
filing date -
Dec 22, 1994
priority date (Note) -
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Abstract
An electronic packaging module for inverted bonding of semiconductor devices, integrated circuits, and/or application specific integrated circuits is produced with protuberances on the conductive pattern of the substrate. The protuberances are of a soft, ductile metal capable of being metallurgically bonded to the input/output pads of semiconductor devices. The input/output pads of the semiconductor devices are simultaneously bonded to the protuberances of the packaging module.
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