Semiconductor integrated circuit having a plurality of semiconductor chips
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Aug 11, 1998
Grant Date -
N/A
app pub date -
Apr 25, 1996
filing date -
May 30, 1995
priority date (Note) -
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status (Latency Note)
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Abstract
A central portion of a front surface of a first semiconductor chip is bonded to a first surface of a die pad of a lead frame via an elastic insulating film. A peripheral portion having electrodes of the front surface is outside of the die pad. With a back surface of the first semiconductor chip put in contact with a jig surface, wire bonding of the first semiconductor chip is performed. Then, with a second surface of the die pad opposite from the first semiconductor chip put in contact with a jig surface, a back surface of a second semiconductor chip is bonded to the back surface of the semiconductor chip via an adhesive. With the second surface of the die pad put in contact with a jig surface, wire bonding of the second semiconductor chip is performed.
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