Projection optical apparatus for projecting a mask pattern onto the surface of a target projection object and projection exposure apparatus using the same
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United States of America Patent
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Aug 11, 1998
Issued Date -
N/A
app pub date -
Jan 2, 1997
filing date -
Jun 9, 1994
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Abstract
A projection exposure apparatus projects the pattern of a reticle at a high resolution even when a wafer which is poor in flatness because of its warping or step is used. An illumination light beam emitted from a light source system illuminates a reticle through a condenser lens. The illumination light beam emerging from the reticle forms the intermediate image of the pattern of the reticle at a position near the reflecting surface of a reflecting mirror through a half prism and a projection lens. The illumination light beam reflected by the reflecting surface forms the pattern image of the reticle onto the surface of a wafer after passing through the projection lens and the half prism again. The shape of the reflecting surface of the reflecting mirror is changed to conform to the shape of the surface of the wafer.
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