Microelectronics unit mounting with multiple lead bonding
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United States of America Patent
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Aug 18, 1998
Issued Date -
N/A
app pub date -
May 8, 1995
filing date -
Feb 1, 1994
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A component for mounting semiconductor chips or other microelectronic units includes a flexible top sheet with an array of terminals on it, and with flexible leads extending downwardly from the terminals. A compliant dielectric support layer surrounds the leads, holding the lead tips in precise locations. The leads are desirably formed from wire such as gold wire, and have eutectic bonding alloy on their tips. The component can be laminated to a chip or other unit under heat and pressure to form a complete subassembly with no need for individual bonding to the contacts of the chip. The subassembly can be tested readily and provides compensation for thermal expansion.
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