Importance

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Abstract

A device for rotating a substrate in a complex motion within a chamber which during a sputtering process. The device includes a first support element positioned within the chamber. The first support element includes a first rotating structure which is affixed between a platform for supporting the substrate and a first magnet positioned adjacent to the inner wall surface. Further, the first rotating structure is adapted to rotate about a first axis. The device further includes a second support element positioned outside of the chamber. The second support element includes a second rotating structure affixed between a planet gear adapted for engagement with a sun gear outside of the chamber and a second magnet positioned adjacent the outer wall surface and spaced apart from the first magnet. This causes the formation of a magnetic bond between the first and second magnets. Further, the second rotating structure is adapted to rotate about the first axis thereby enabling the first and second rotating structures to rotate in unison about the first axis. In addition, the device includes a drive element affixed to the first and second support elements, wherein rotation of the drive element causes a first rotation of the first and second rotating elements and thus the substrate about a center axis. This also causes a second rotation wherein the engagement of the sun gear and the planet gear causes simultaneous rotation of the substrate about the first axis.

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First Claim