US Patent No: 5,796,587

Number of patents in Portfolio can not be more than 2000

Printed circut board with embedded decoupling capacitance and method for producing same

Stats

ATTORNEY / AGENT: (SPONSORED)
 

Importance

Loading Importance Indicators... loading....

Abstract

A method is provided for producing a capacitor to be embedded in an electronic circuit package comprising the steps of selecting a first conductor foil, selecting a dielectric material, coating the dielectric material on at least one side of the first conductor foil, and layering the coated foil with a second conductor foil on top of the coating of dielectric material. Also claimed is an electronic circuit package incorporating at least one embedded capacitor manufactured in accordance with the present invention.

Loading the Abstract Image... loading....

First Claim

Related Publications

Loading Related Publications... loading....

Patent Owner(s)

Patent OwnerAddressTotal Patents
INTERNATIONAL BUSINESS MACHINES CORPORATIONARMONK, NY68180

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lauffer, John M Waverly, NY 143 1022
Papathomas, Konstantinos Endicott, NY 24 233

Cited Art

Patent Info (Count) # Cites Year
 
U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE (5)
5,079,069 Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture 175 1989
5,155,655 Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture 139 1990
5,162,977 Printed circuit board having an integrated decoupling capacitive element 98 1991
5,161,086 Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture 137 1992
5,261,153 In situ method for forming a capacitive PCB 164 1992
 
STORAGE TECHNOLOGY CORPORATION (2)
5,428,499 Printed circuit board having integrated decoupling capacitive core with discrete elements 42 1993
5,469,324 Integrated decoupling capacitive core for a printed circuit board and method of making same 119 1994
 
HUGHES AIRCRAFT COMPANY (1)
4,792,779 Trimming passive components buried in multilayer structures 37 1988
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (1)
5,027,253 Printed circuit boards and cards having buried thin film capacitors and processing techniques for fabricating said boards and cards 106 1990
 
MURATA MANUFACTURING CO., LTD. (1)
5,172,304 Capacitor-containing wiring board and method of manufacturing the same 58 1991
 
POLY CIRCUITS, INC. (1)
4,775,573 Multilayer PC board using polymer thick films 40 1987
 
RAYTHEON COMPANY (1)
5,144,526 Low temperature co-fired ceramic structure containing buried capacitors 34 1991
 
UNISYS CORPORATION (1)
5,010,641 Method of making multilayer printed circuit board 94 1989

Patent Citation Ranking

Forward Cites

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (7)
6,215,649 Printed circuit board capacitor structure and method 62 1998
6,542,379 Circuitry with integrated passive components and method for producing 14 1999
6,370,012 Capacitor laminate for use in printed circuit board and as an interconnector 29 2000
6,343,001 Multilayer capacitance structure and circuit board containing the same 6 2000
6,496,356 Multilayer capacitance structure and circuit board containing the same and method of forming the same 4 2001
6,524,352 Method of making a parallel capacitor laminate 24 2002
6,815,085 Printed circuit board capacitor structure and method 8 2003
 
INTEL CORPORATION (6)
6,970,362 Electronic assemblies and systems comprising interposer with embedded capacitors 40 2000
6,611,419 Electronic assembly comprising substrate with embedded capacitors 46 2000
6,775,150 Electronic assembly comprising ceramic/organic hybrid substrate with embedded capacitors and methods of manufacture 17 2000
7,120,031 Data processing system comprising ceramic/organic hybrid substrate with embedded capacitors 10 2004
7,339,798 Electronic assemblies and systems comprising interposer with embedded capacitors 3 2005
7,535,728 Electronic assemblies comprising ceramic/organic hybrid substrate with embedded capacitors 0 2006
 
SHINKO ELECTRIC INDUSTRIES CO., LTD. (5)
6,640,429 Method of making multilayer circuit board 1 2002
6,764,931 Semiconductor package, method of manufacturing the same, and semiconductor device 12 2002
6,921,977 Semiconductor package, method of production of same, and semiconductor device 11 2003
6,884,655 Semiconductor package, method of manufacturing the same, and semiconductor device 4 2004
7,314,780 Semiconductor package, method of production of same, and semiconductor device 4 2005
 
TERADATA US, INC. (5)
6,844,505 Reducing noise effects in circuit boards 4 2002
7,626,828 Providing a resistive element between reference plane layers in a circuit board 2 2003
7,271,348 Providing decoupling capacitors in a circuit board 2 2003
7,216,422 Method of forming a capacitor assembly in a circuit board 1 2004
7,791,896 Providing an embedded capacitor in a circuit board 2 2007
 
MITAC TECHNOLOGY CORP. (4)
6,489,570 Multi-layer circuit board 2 2001
6,417,460 Multi-layer circuit board having signal, ground and power layers 4 2001
RE40068 Multi-layer circuit board having signal, ground and power layers 0 2004
RE39766 Multi-layer circuit board 0 2004
 
3M INNOVATIVE PROPERTIES COMPANY (3)
6,274,224 Passive electrical article, circuit articles thereof, and circuit articles comprising a passive electrical article 30 1999
6,638,378 Passive electrical article, circuit articles thereof, and circuit articles comprising a passive electrical article 15 2001
6,577,492 Capacitor having epoxy dielectric layer cured with aminophenylfluorenes 6 2001
 
CTS CORPORATION (3)
6,326,677 Ball grid array resistor network 17 1998
7,180,186 Ball grid array package 0 2003
6,946,733 Ball grid array package having testing capability after mounting 3 2003
 
FORCE 10 NETWORKS, INC. (3)
7,448,132 Method of fabricating a high-layer-count backplane 0 2006
8,026,450 Multi-dielectric material circuit board supporting high-speed and low-speed signaling 0 2007
7,615,709 Circuit board through-hole impedance tuning using clearance size variations 0 2007
 
MITAC INTERNATIONAL CORP. (2)
6,548,858 Multi-layer circuit board 2 2001
6,384,340 Multi-layer circuit board 3 2001
 
MOTOROLA SOLUTIONS, INC. (2)
7,056,800 Printed circuit embedded capacitors 4 2003
7,138,068 Printed circuit patterned embedded capacitance layer 1 2005
 
SAMSUNG ELECTRO-MECHANICS CO., LTD. (2)
7,281,321 Printed circuit board having embedded capacitors using hybrid material and method of manufacturing the same 4 2006
8,302,270 Method of manufacturing capacitor-embedded PCB 0 2011
 
TPL, INC. (2)
6,616,794 Integral capacitance for printed circuit board using dielectric nanopowders 24 1999
6,608,760 Dielectric material including particulate filler 7 1999
 
BALLADO INVESTMENTS INC. (1)
6,367,678 Process for stacking layers that form a multilayer printed circuit 0 2000
 
CTC CORPORATION (1)
6,005,777 Ball grid array capacitor 21 1998
 
DENSO CORPORATION (1)
7,286,367 Printed circuit board with a built-in passive device, manufacturing method of the printed circuit board, and elemental board for the printed circuit board 0 2003
 
NEC CORPORATION (1)
6,075,211 Multi-layered printed wiring board 67 1996
 
NGK SPARK PLUG CO., LTD. (1)
6,214,445 Printed wiring board, core substrate, and method for fabricating the core substrate 29 1999
 
OAK-MITSUI, INC. (1)
6,657,849 Formation of an embedded capacitor plane using a thin dielectric 21 2000