Printed circut board with embedded decoupling capacitance and method for producing same
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United States of America Patent
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Aug 18, 1998
Grant Date -
N/A
app pub date -
Jun 12, 1996
filing date -
Jun 12, 1996
priority date (Note) -
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Abstract
A method is provided for producing a capacitor to be embedded in an electronic circuit package comprising the steps of selecting a first conductor foil, selecting a dielectric material, coating the dielectric material on at least one side of the first conductor foil, and layering the coated foil with a second conductor foil on top of the coating of dielectric material. Also claimed is an electronic circuit package incorporating at least one embedded capacitor manufactured in accordance with the present invention.
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