Styrenic resin composition and polystyrene oriented film
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United States of America Patent
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Aug 25, 1998
Grant Date -
N/A
app pub date -
Jul 29, 1996
filing date -
Dec 7, 1994
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention relates to a styrenic resin composition which comprises 90 to 99.99% by weight of a styrenic polymer having a high degree of syndiotctic configuration (SPS) and 0.01 to 10% by weight of a spherical aluminosilicate having pH in the range of 5 to 11; a polystyrene oriented film which comprises the above styrenic resin composition molded into an oriented film; a styrenic resin composition which comprises 99.2 to 99.95% by weight of a styrenic polymer having a high degree of syndiotactic configuration and 0.05 to 0.8% by weight of a spherical regular elastomer having an average grain size in the range of 0.1 to 3 .mu.m, and which has a melt index at 300.degree. C. under 2.16 kg load being in the range of 1 to 50; and a polystyrene oriented film which comprises the above styrenic resin composition molded into an oriented film. According to the present invention, there are provided styrenic resin compositions each being excellent in melt-heat-stability, minimized in the generation of white powders at the time of continuous film forming and capable of producing oriented films that are favorable in slipperiness, dielectric breakdown voltage (AC), tear strength and the like; and polystyrene oriented films useful as a variety of base materials for films.
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