Method of automatically generating dummy metals for multilevel interconnection
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United States of America Patent
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Aug 25, 1998
Grant Date -
N/A
app pub date -
Feb 9, 1996
filing date -
Feb 9, 1996
priority date (Note) -
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Abstract
A method of automatically generating dummy metals for multilevel interconnection makes use of a quantum array pattern accompanying an operating pattern to from a metal pattern. The method comprises the combination selected from intersection (AND), union (OR), oversizing, downsizing, or incorporation operation through computer-aided design (CAD). Therefore, the application of the metal pattern to a process for fabricating a multimetal structure can acquire full planarization between two metal layers because of the arrangement that several dummy metals are positioned among the metal lines to diminish the spacing which exceeds the planarization limit. Also, the dummy metals are shaped in blocks thereby preventing the loading effect during etching and decreasing the parasitic capacitance therebetween.
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