High density electrical interconnect apparatus and method
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United States of America Patent
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Sep 1, 1998
Issued Date -
N/A
app pub date -
Dec 11, 1995
filing date -
Mar 8, 1994
priority date (Note) -
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status (Latency Note)
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Abstract
The present invention relates generally to a new apparatus and method for use in chip, module, card, etc., burn-in and/or test or electrical interconnection. More particularly, the invention encompasses an apparatus that is used as a temporary media between a chip, module, card, etc., that needs to be tested and/or burned-in and a test or burn-in system. A method for such burn-in and/or test or electrical interconnection is also disclosed. The invention also encompasses an apparatus and a method that can be used as a permanent media between two electrical devices, such as, for example, between a chip and a module or a card, etc., that is to be contained in and part of a system.
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