System for encapsulation of electric wire splices
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United States of America Patent
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Sep 1, 1998
Grant Date -
N/A
app pub date -
Mar 20, 1996
filing date -
Mar 20, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A system including the method and apparatus for encapsulating electric wire splices wherein a plurality of electrical conductors in substantially aligned opposed relationship are electrically spliced and an encapsulation mass of thermoplastic dielectric material forms an insulative jacket over the splice. Encapsulation is produced by coating the spliced conductors with a liquified hot melt sealant, agitating and projecting the sealant toward the splice to fill small interstices between the conductors, removing the coated splice and conductors from the liquid sealant and drying the sealant into a dielectric jacket surrounding the splice.
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