Copper coating of printed circuit boards
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United States of America Patent
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-
Sep 1, 1998
Grant Date -
N/A
app pub date -
Dec 11, 1995
filing date -
Dec 12, 1994
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A process for copper coating printed circuit boards is disclosed. The process includes a treating step in which a metal surface is contacted with an adhesion promotion composition material. The adhesion promotion material includes 0.1 to 20% by weight hydrogen peroxide, an inorganic acid, an organic corrosion inhibitor and a surfactant.
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