Method of making an air tight cavity in an assembly package
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United States of America Patent
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Sep 1, 1998
Issued Date -
N/A
app pub date -
Feb 20, 1996
filing date -
Feb 20, 1996
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of making an assembly package having an airtight cavity for housing an electrical element, such as a semiconductor chip. The method includes bonding a shell to a conductive base with a thermally setting alpha-staged epoxy resin which is characterized as being a gel in the uncured state at room temperature. The use of the alpha-staged epoxy resin, in contrast with the conventional beta-staged epoxy resin, results in an airtight cavity being formed without punctures or fissures in the epoxy resin. The method also provides a two-step heating process whereby the epoxy resin is cured at a first elevated temperature in the open atmosphere and further cured and stabilized at a second elevated temperature in a closed environment.
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