Semiconductor device and semiconductor device unit for a stack arrangement

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United States of America Patent

PATENT NO 5801439
SERIAL NO

08804270

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Abstract

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A semiconductor device includes a semiconductor element, a package sealing the semiconductor element, and leads for passing signals between the semiconductor element and an external device. Each of the leads has an inner-lead part sealed within the package and connected with the semiconductor element, and an outer-lead part which extends outward from the package toward a top of the package, and is to be connected to the external device. The outer-lead part includes a first-port part at a lower side of the package, and a second-port part at an upper side of the package.

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Patent Owner(s)

  • FUJITSU LIMITED

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fujisawa, Tetsuya Kawasaki, JP 27 1090
Hayashida, Katsuhiro Kawasaki, JP 9 518
Ishiguri, Masahiko Kawasaki, JP 7 292
Kasai, Junichi Kawasaki, JP 110 3447
Mizukoshi, Masataka Kawasaki, JP 75 1771
Otokita, Kosuke Kawasaki, JP 3 158
Sato, Mitsutaka Kawasaki, JP 57 2436
Sono, Michio Kawasaki, JP 28 1062
Takashima, Akira Kawasaki, JP 130 2677
Yoshimura, Hiroshi Kawasaki, JP 124 1722

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