Importance

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Abstract

A microelectronic component such as a semiconductor chip having electrical contacts is provided with terminals, the terminals being movable relative to the component. A joining unit having a solid core is disposed on each terminal and extends upwardly, away from the component. Each unit includes a bonding material such as a solder bonding the terminal and the solid core, the bonding material desirably defining a waist or narrow section spaced above the terminal, the waist having a curved surface forming a stress-relieving fillet. The joining units are bonded to contact pads of a substrate such as a circuit panel as by bonding the solder of the joining units to the terminals, or by means of a further solder on the contact pads having a lower melting point. The assembly provides substantial resistance to mechanical stress caused by thermal expansion. Preferably, the terminals are movable in vertical directions towards the component to compensate for nonplanarity during assembly.

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First Claim