Circuit board manufacturing method
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 8, 1998
Issued Date -
N/A
app pub date -
Jun 6, 1996
filing date -
Jan 20, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A circuit board manufacturing method for manufacturing a printed circuit board with improved characteristics for machine soldering. The circuit board manufacturing method includes the addition of a polyimide 'B' semicured material to a printed circuit board prior to preheating and then machine soldering the printed circuit board. The polyimide 'B' semicured material retards heat and is used to eliminate the common 'hot' and 'cold' spots that occur with printed circuit boards during the preheat cycle prior to machine soldering of the printed circuit board. As a result of the heat retardation due to the polyimide 'B' state material the circuit board is thoroughly and properly heated during the preheat cycle to eliminate hot and cold spots so that proper machine soldering can occur. A number of different methods are presented and in one method polyimide 'B' stage material is used to prevent movement of thermal pads.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully