Composite solder paste for flip chip bumping
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United States of America Patent
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Sep 8, 1998
Grant Date -
N/A
app pub date -
Sep 29, 1995
filing date -
Sep 29, 1995
priority date (Note) -
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Abstract
Composite solder paste compositions adapted to be deposited using a dry film photoresist mask to form solder joints for flip chip integrated circuit devices. The composite solder paste compositions are characterized by the ability to flow at a first temperature during bumping reflow while the photoresist mask is present, yet upon subsequently reheating to a higher temperature yield solder joints capable of withstanding temperatures of 200.degree. C. and higher. As such, the present invention retains the advantages associated with using a dry film photoresist as a mask during deposition of the solder, yet results in the formation of solder joints that exhibit enhanced reliability in severe thermal environments.
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