Process for making preforms useful for encapsulating semiconductors

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United States of America Patent

PATENT NO 5804126
SERIAL NO

08868679

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Abstract

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Preform useful for encapsulating semiconductors and other electric or electronic devices are prepared by a process which comprises warming thermoset resin to form a melt, injecting it into a mold, and cooling to form a solidified molding, all without substantially curing the thermoset resin.

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Patent Owner(s)

  • AMOCO CORPORATION;COOKSON SINGAPORE PTE LTD

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chin, Neep Hing Singapore, SG 1 3
Chua, Jr Manuel Alameda Singapore, SG 1 3
Karunaratne, Palitha Mahendra S Singapore, SG 1 3
Rounds, Nicholas Andrew New Britain, PA 1 3
Srinivasan, Visveswaran Singapore, SG 1 3

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