Process for manufacturing a packaged semiconductor having a divided leadframe stage
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United States of America Patent
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Sep 8, 1998
Issued Date -
N/A
app pub date -
Nov 21, 1995
filing date -
Mar 17, 1993
priority date (Note) -
Expired
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Abstract
A process for manufacturing semiconductor device having a package in which a semiconductor device is sealed includes a base, and a metallic film is formed on a surface of the base. The semiconductor chip is formed on the metallic film. A pad formed on the semiconductor chip is connected to the metallic film by a wire. A sealing layer is formed on the metallic film. Leads are formed on the glass layer. A connecting layer is formed on the metallic film and contains electrically conductive particles. The connecting layer is in contact with a lead for a power supply system and connecting the metallic film to the lead.
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