Abrasive composition and use of the same
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United States of America Patent
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Sep 8, 1998
Grant Date -
N/A
app pub date -
Aug 29, 1997
filing date -
Aug 29, 1996
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An abrasive composition is provided comprising an oxidizing agent and abrasive particles which have a mean particle size of 2 .mu.m or less, wherein each of the abrasive particles comprises (i) at least one oxide selected from aluminum oxide and silicon oxide and (ii) cerium oxide in an amount of 5% to 40% by weight in terms of cerium based on the oxide (i). A method for polishing and planarizing a metal layer formed on a semiconductor substrate using the abrasive composition is also provided.
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