Semiconductor package with flexible board and method of fabricating the same
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United States of America Patent
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Sep 8, 1998
Issued Date -
N/A
app pub date -
Aug 15, 1997
filing date -
Sep 21, 1994
priority date (Note) -
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Abstract
Solder balls are attached to a flexible printed-circuit board which is shaped so as to be able to cover at least an upper surface, a side surface, and a lower surface of an IC chip, and the flexible printed-circuit board is placed on the IC chip. Then, the flexible printed-circuit board is folded over edges of the IC chip, and bonded to outer surfaces of the IC chip by an adhesive sheet. Thereafter, a sealing resin is poured into a gap between the upper surface of the IC chip and the flexible printed-circuit board, and cured, thereby completing a semiconductor package.
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