Ball grid array electronic package standoff design
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United States of America Patent
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-
Sep 8, 1998
Grant Date -
N/A
app pub date -
Feb 14, 1996
filing date -
Feb 14, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A surface mount package to encapsulate one or more semiconductor devices has a standoff that maintains the thickness of solder columns bonding the package to an external circuit. The standoff either extends over or circumscribes a central portion of the package base. To enhance the thermal performance of the standoff, a solderable layer enhances soldering of the standoff to the external circuit. In alternative embodiments, the standoff contains a flange having a plurality of apertures useful for either mechanically locking an adhesive or for enabling irradiation of an adhesive by a light source. The standoff may contain protrusions for alignment, strength or circuit routing.
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