Contact carriers (tiles) for populating larger substrates with spring contacts
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United States of America Patent
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Sep 15, 1998
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app pub date -
Jan 24, 1997
filing date -
Nov 16, 1993
priority date (Note) -
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Abstract
The invention relates to making temporary, pressure connections between electronic components and, more particularly, to techniques for performing test and burn-in procedures on semiconductor devices prior to their packaging, preferably prior to the individual semiconductor devices being singulated from a semiconductor wafer.
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