Importance

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Abstract

The manufacture of the electronics component of the probe is simplified by using an integral lead frame on which is mounted all of the passive and active elements so that the entire electronics module can be assembled independent of the housing in a simplified form prior to integration into the housing. The lead frame provides not only the electrical interconnections but the support and positioning of the various light emitting elements that comprise the electronics of the probe. The remaining segment of the manufacturing process is simplified since the workers do not have to assemble multiple diverse elements to create the device housing. The light reflecting and lens assemblies lock together and enclose an epoxy material which encapsulates the electronics elements and provides improved optical transmissivity of the generated light.

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First Claim