Importance

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Abstract

A method for forming an interconnect for making a temporary or permanent electrical connection to a semiconductor dice is provided. The method includes forming a substrate with an insulating layer and a pattern of conductors thereon. The conductors are formed as a bi-metal stack including a barrier layer formed of an inert metal and a conductive layer formed of a highly conductive metal. Microbumps are formed on the conductors by deposition through a mask using an electroplating, electroless plating, screen printing or evaporation process. The interconnect can be used to provide a temporary electrical connection for testing bare semiconductor dice. Alternately the interconnect can be used for flip chip mounting dice for fabricating multi chip modules and other electronic devices.

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First Claim