Electronic component assembly having an encapsulation material and method of forming the same
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United States of America Patent
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Sep 15, 1998
Grant Date -
N/A
app pub date -
May 30, 1997
filing date -
May 30, 1997
priority date (Note) -
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Abstract
An electronic component assembly (10) is formed by mounting an electronic component (31) to a substrate (11). An encapsulating material (33) is used to protect the electronic component (31) from environmental hazards. The encapsulating material (33) is formed by dispensing an encapsulating fluid over the electronic component (31). A trench (36) is formed in a masking layer (21) on a substrate (11) to stop the flow of the encapsulating fluid. The trench (36) provides an edge (35) which acts as a discontinuity in the surface (23) of the masking layer (21). This discontinuity is sufficient to control the flow of the encapsulating fluid until the encapsulating fluid is cured to form the encapsulating material (33).
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