Microelectronic connections with liquid conductive elements
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United States of America Patent
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Sep 15, 1998
Grant Date -
N/A
app pub date -
May 2, 1996
filing date -
May 2, 1996
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Abstract
A microelectronic assembly including elements such as a semiconductor chip and substrate has electrical connections between the elements incorporating fusible conductive metal masses. The fusible masses are surrounded and contained by a compliant material such as an elastomer or gel. The fusible material may melt during operation or processing of the device to relieve thermal cycling stress in the electrical connections.
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