Integrated circuit device having interchangeable terminal connection
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United States of America Patent
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Sep 15, 1998
Grant Date -
N/A
app pub date -
Mar 5, 1996
filing date -
Mar 5, 1996
priority date (Note) -
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status (Latency Note)
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Abstract
An integrated circuit package allows coupling of an integrated device within the package to the signal terminals of the package according to more than one connection pattern. The connection pattern is realized by coupling multiplexers between the integrated device and the signal terminals such that the pattern of coupling between the integrated device and the signal terminals can be controlled by a control signal. The control signal can be produced external to the package or within the package. In response to a control signal of the first state, the signal terminals are connected to the integrated device in a first pattern. In response to the control signal in the second state, the signal terminals are connected to the integrated device in a second pattern, different from the first pattern. In one embodiment, the first pattern and second pattern are mirror images to allow the packages to be mounted to opposite sides of a module while minimizing routing difficulties.
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