Importance

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Abstract

A method for detecting deterioration of solder paste printing includes defining a check pattern region on a portion of the printed circuit board PC separated from the electrical circuit, forming fine pitch check through-holes 8a in the metal mask 7 with a pitch finer than that of the electrical circuit within a region of the metal mask corresponding to the check pattern region, printing solder paste 9 onto the check pattern region through the fine pitch check through-holes of the metal mask, monitoring for defects in the printed check pattern and detecting a defect in the check pattern region before the solder paste printing onto the electrical circuit has deteriorated. The method enables maintenance of the best condition of the solder paste printing onto the electrical circuit.

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First Claim